Date: Fri, 29 Mar 2024 08:15:41 +0000 (UTC) Message-ID: <1513334936.1.1711700141561@5e5276290dfa> Subject: Exported From Confluence MIME-Version: 1.0 Content-Type: multipart/related; boundary="----=_Part_0_2126587426.1711700141549" ------=_Part_0_2126587426.1711700141549 Content-Type: text/html; charset=UTF-8 Content-Transfer-Encoding: quoted-printable Content-Location: file:///C:/exported.html
Joshua Alexander Board updates
Communication with Mo sounds challenging; we need to make our hypotheses= include hand soldering as root cause
Headers soldered at 350=C2=BA C
= Alex Moreno noticed a via cutout shape around vias that are typical in = Altium vias but not present in Kicad vias that may prevent excess heat flow= away from pin during soldering
Success with epoxy and hot plate w/ glass bowl on top to trap heat
= li>Dropping off more parts for assembly today as long as Austin Patel a= nd = Alex Moreno don=E2=80=99t find showstopping issues with testing today= p>