Joshua Alexander picking up 2 boards
motes → quik-pak → Digicom (Mo’s)
next is to verify all works without pins attached
verify whether any bubbling present
unclear whether we had a photo of the quik-pak’ed modules
Mo indicated he would use a lower-temp solder; he indicated he uses some “shielding” (when attaching surface-mount components?)
Joshua Alexander confirms he will be able to test boards today
Kristofer PISTER opaque epoxy has a higher temperature, putting it on the wirebonds but leaving the centre of the chip without epoxy may be possible
Andrew Fearing points at https://www.qptechnologies.com/services/ic-assembly/encapsulation-options/
trying to find the root cause of SCuM not be able to transmit to nRF: tone separation error, or chipping clock
using divided LC for the chipping clock, there is a 400ppm swing between “0’s” and “1’s”?
with access to GPIOs, would be easier, chip used is not wire-bonded completely
looking at what probe station and wire bonder within driving distance
PhD thesis defended
Manuscript: Agile Multi-PHY Wireless Networking
some interesting deliverables:
g6TiSCH firmware: how to custom build your g6TiSCH/6DYN network? https://github.com/minarady1/openwsn-fw/tree/develop_FW-891
RPLSim: yet another RPL simulator: a lightweight discrete event RPL simulator in Python
Allowed us to answer the question "how to optimize for time-to-first-death"? (specially using multi-PHY integration)
Life-OF
Example configuration: run using a single-PHY network MRHOF and compare it to a multi-PHY network using Life-OF.