Attendees
Updates
Joshua Alexander picking up the boards
motes → quik-pak → Digicom (Mo’s)
next is to verify all works without pins attached
verify whether any bubbling present
unclear whether we had a photo of the quik-pak’ed modules
Mo indicated he would use a lower-temp solder; he indicated he uses some “shielding” (when attaching surface-mount components?)
Kristofer PISTER opaque epoxy has a higher temperature, putting it on the wirebonds but the
PhD thesis defended
Manuscript: Agile Multi-PHY Wireless Networking
some interesting deliverables:
g6TiSCH firmware: how to custom build your g6TiSCH/6DYN network? https://github.com/minarady1/openwsn-fw/tree/develop_FW-891
RPLSim
: yet another RPL simulator: a lightweight discrete event RPL simulator in PythonAllowed us to answer the question "how to optimize for time-to-first-death"? (specially using multi-PHY integration)
Life-OF
Example configuration: run using a single-PHY network MRHOF and compare it to a multi-PHY network using Life-OF.