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14-Jul-2021

14-Jul-2021

Owned by David Burnett
Jul 14, 2021
1 min read

Attendees

  1. @Austin Patel

  2. @David Burnett

  3. @Joshua Alexander

  4. @Kristofer PISTER

Action items

@Austin Patel to send python script and SCuM firmware for probe station die boot tests
@Austin Patel possibly drop by lab Saturday to identify McCoy and Spock PCBs

Minutes

  • Planning for visit to Berkeley by @David Burnett and @Fil Maksimovic

    • Optical programmer boards on preprogrammed Teensys should be readily available in lab. @David Burnett is bringing his too just in case.

    • Dice packages identified

    • Current status of die tests are tabulated here: https://docs.google.com/spreadsheets/d/14XAfxGwL6wk_KUb9GTKfo5KeL4-N5aEMuYoCTwm1jF0/edit

      • Sheet corresponds to one die pack only; other die packs are untested

      • Die pack should be oriented with the cut corner in upper-right

      • Die numbering in sheet is, e.g., die 6 is in row 1, column 6. Ignore columns in dice tray that are completely empty.

      • If in question, use dice that are missing to align numbering

    • Testing procedure:

      • Drop probes on VBAT and GND, apply 1.5 V, measure current

      • Optically program with GPIO toggle firmware

      • If current only increases by ~30 uA, chip requires vddd tap. If current increases up to ~2 mA, chip is cold boot-capable.

    • Further tests:

      • After optical calibration, current should return to ~200 uA

      • Bare die can communicate with OpenMote at a range of a few cm. Joining a network on probe station is possible but would require 3rd probe contact to perform vddd tap operation and boot OpenWSN firmware.

    • Bond diagram for SCuM/McCoy is here: https://github.com/PisterLab/scum-dev-board/blob/master/mccoy/pictures/smallBoard_bond_diagram_for_self_testing.pdf

 

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